Multi-light emitting diode package

ABSTRACT

A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority from and the benefit of Korean PatentApplication No. 10-2007-0065228, filed on Jun. 29, 2007, and KoreanPatent Application No. 10-2008-0028793, filed on Mar. 28, 2008, all ofwhich are hereby incorporated by reference for all purposes as if fullyset forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a multi-light emitting diode(multi-LED) package, and more particularly to a multi-LED package tosimultaneously or individually emit different colors of light includingwhite, infrared or ultraviolet.

2. Description of the Related Art

Generally, an LED package includes an LED chip, a lead frame throughwhich electric current is applied to the LED chip, and a housing forsupporting the lead frame. In recent years, attention to LEDpackage-based lightings has rapidly increased. To apply the LED packageto lightings, improved luminescence and a high optical output of 1,000'sof lumens or more are sought. Since output luminescence is proportionalto the amount of input current, a desired optical output can be obtainedby supplying a high electric current to the LED chip. However, thisincrease in input current may generate excessive heat.

Further, if the heat is not dissipated from the LED package, the heatmay cause dislocations and mismatches in a semiconductor crystal of theLED chip, thereby reducing a service life of the LED chip. Hence, a heatsink is provided to the LED package as a heat absorption or dissipationsource.

The LED package may include a plurality of LED chips mounted on a heatsink formed of a single heat dissipation slug to emit light of differentwavelengths such that the LED chips can be individually operated to emitmultiple colors. In general, a red LED chip, a green LED chip, and ablue LED chip are mounted together in a single LED package to emitplural colors by operating the LED chips in an individual manner or incombination. One example of this technique is disclosed in Korean PatentNo. 0558082 issued to this application's Assignee.

However, if the LED chips for emitting red, green and blue colors aremounted together in the single LED package, all of the LED chips areoperated to emit white light. Accordingly, it is difficult for the LEDpackage to adjust the balance between colors.

Additionally, since an LED chip for emitting white light includes aphosphor, there are many difficulties in mounting the white LED chip andother LED chips for emitting different colors in a single LED package.

Furthermore, to achieve individual operation of the LED chips on asingle heat dissipation slug made of a conductive metal, the LED chipshave been lateral-type LED chips that are electrically insulated fromthe heat dissipation slug, and each LED chip is electrically wired by atwo-bonding method in which the LED chip is connected to two lead-framesvia two bonding wires. Therefore, for a vertical-type LED chip having anelectrode disposed on the bottom of the LED chip and electricallyconnected to the heat dissipation slug, application thereof to such anLED package as described above is difficult.

SUMMARY OF THE INVENTION

The present invention provides a multi-LED package that includes a whiteLED chip and other color LED chips in a single package to emit a varietyof colors while providing improved heat dissipation.

The present invention also provides a multi-LED package to individuallyemit white light and other color light while providing improved heatdissipation.

Additional features of the invention will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention.

The present invention discloses a multi-LED package including: a heatsink including a primary slug and a secondary slug separated from eachother; a primary LED chip mounted on the primary slug; a secondary LEDchip mounted on the secondary slug; a lead frame structure electricallywired to the primary and secondary LED chips to individually operate theprimary and secondary LED chips; and a phosphor on above the primaryslug to cover at least a part of the primary LED chip.

The multi-package may further include a housing to support the leadframe structure and the heat sink. Here, the housing has an openingformed at an upper portion thereof through which light generated fromthe primary and secondary LED chips is emitted to an outside.

Light obtained by a combination of the primary LED chip and the phosphormay be white light.

The primary slug may include a cavity depressed on an upper surfacethereof to accommodate the primary LED chip. Here, the cavity is filledwith the phosphor that covers the primary LED chip.

The primary LED chip is attached to a bottom surface of the cavity.Here, the bottom surface of the cavity is coplanar with an upper surfaceof the secondary slug to which the secondary LED chip is attached.

Alternatively, the primary slug may include a partition protruding fromthe upper surface thereof to define a partitioned space inside thepartition, and the partitioned space may accommodate the primary LEDchip therein and be filled with the phosphor covering the primary LEDchip.

Alternatively, the primary slug may include a partition or a cavityformed thereon to accommodate the primary LED chip and the phosphorinside the partition or the cavity, and the secondary slug may include apartition or a cavity formed thereon to accommodate the secondary LEDchip inside the partition or the cavity.

The heat sink may include a single primary slug and a plurality of thesecondary slugs. Here, the single primary slug and the plural secondaryslugs are disposed outside a center of the opening, and the primary LEDchip and the secondary LED chip are disposed along the samecircumference around the center of the opening on the single primaryslug and the secondary slugs, respectively.

Each of the primary and secondary LED chips may be one selected from avertical-type LED chip electrically connected to the heat sink in adirect manner and a lateral type LED chip electrically connected to thelead frame structure via two bonding wires while being electricallyinsulated from the heat sink.

The lead frame structure may include a plurality of lead frames. Thenumber of lead frames is twice or more the total number of slugsincluding the primary and secondary slugs.

The present invention also discloses a multi-LED package including: aheat sink including an upper surface and partitions protruding from theupper surface; a primary LED chip mounted inside the partitions on theheat sink; a secondary LED chip mounted outside the partitions on theheat sink; a lead frame structure electrically wired to the primary andsecondary LED chips to individually operate the primary and secondaryLED chips; and a phosphor disposed on the heat sink to cover at least apart of the primary LED chip.

Light obtained by a combination of the primary LED chip and the phosphormay be white light. The at least one secondary LED chip may be one ormore LED chips selected from a red LED chip, a green LED chip, a blueLED chip, an infrared LED chip, and an ultraviolet LED chip.

The primary and secondary LED chips may be disposed along the samecircumference around a center of the opening.

The partitions may be integrally formed with the heat sink.

The heat sink may further include other partitions formed on the uppersurface thereof to surround the at least one secondary LED chip.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentinvention will become apparent from the following description ofexemplary embodiments given in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view of a multi-LED package according to oneembodiment of the present invention;

FIG. 2 is a plan view of the multi-LED package shown in FIG. 1;

FIG. 3 is a plan view of a multi-LED package according to anotherembodiment of the present invention;

FIGS. 4 (a) to (c) are plan views of slugs according to otherembodiments of the present invention;

FIG. 5 is a perspective view of a multi-LED package according to yetanother embodiment of the present invention;

FIG. 6 is a plan view of the multi-LED package shown in FIG. 5;

FIGS. 7 (a) to (c) are schematic plan views of various modifications ofthe multi-LED package shown in FIG. 5;

FIG. 8 is a plan view of a multi-LED package according to yet anotherembodiment of the present invention; and

FIG. 9 is a plan view of a multi-LED package according to yet anotherembodiment of the present invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Exemplary embodiments of the present invention will be described indetail with reference to the accompanying drawings hereinafter. Theembodiments are given by way of illustration for full understanding ofthe present invention by those skilled in the art. Hence, the presentinvention is not limited to these embodiments and can be realized invarious forms.

FIG. 1 is a perspective view of a multi-LED package according to oneembodiment of the present invention, and FIG. 2 is a plan view of themulti-LED package shown in FIG. 1.

Referring to FIGS. 1 and 2, the multi-LED package 1 of this embodimentincludes a plurality of LED chips 12, 14 a and 14 b, a plurality of leadframes 40 through which electric current is applied to the plurality ofLED chips 12, 14 a and 14 b, and a plurality of slugs 22, 24 a and 24 bacting as a heat sink for heat dissipation and providing areas formounting the plural LED chips 12, 14 a and 14 b. The plural slugs 22, 24a and 24 b serve as heat dissipation elements and power applicationelements for applying electric current to the plural LED chips 12, 14 aand 14 b together with the lead frames 40.

The multi-LED package 1 includes a housing 30 that supports the leadframes 40 and the plural slugs 22, 24 a and 24 b. The housing 30 has anopening 32 formed at an upper portion thereof to surround the LED chips12, 14 a and 14 b. Although not shown in the drawings, the opening 32may be provided with an encapsulation member (not shown) made of atransparent material to protect the LED chips 12, 14 a and 14 b from theexternal environment.

In this embodiment, the plural LED chips 12, 14 a and 14 b include asingle primary LED chip 12 for realizing white light, and two secondaryLED chips 14 a and 14 b for emitting different colors. The primary LEDchip 12 is provided with a phosphor which transforms light of apredetermined wavelength range emitted from the primary LED chip 12 tolight of a different wavelength. As a result, white light can berealized by the combination of the light transformed by the phosphor andnon-transformed light. In this embodiment, white light is obtained bythe combination of the primary LED chip 12 emitting blue light and ayellow phosphor 52. However, the present invention is not limitedthereto. To realize white light, a variety of combinations between avariety of LED chips and a variety of phosphors can be considered.

Herein, among the plural slugs 22, 24 a and 24 b, the slug 22 havingboth the primary LED chip 12 and the phosphor 52 is referred to as a“primary slug,” and the slugs 24 a and 24 b having the secondary LEDchips 14 a and 14 b are referred to as “secondary slugs.” The primaryslug 22 and the secondary slugs 24 a and 24 b may be formed by dividinga single semi-cylindrical metallic material such that the slugs arespaced from one another. Here, division and separation of the singlesemi-cylindrical metallic material are performed such that a singlesemi-circular primary slug 22 and two fan-shaped secondary slugs 24 a,24 b can be arranged outside the center C (see FIG. 2) of the opening 32of the housing 30.

As clearly shown in FIG. 2, the primary LED chip 12 and the secondaryLED chips 14 a and 14 b are disposed on the primary slug 22 and thesecondary slugs 24 a and 24 b, respectively, along the same imaginarycircumference R spaced a predetermined radius from the center C of theopening 32. Hence, all of the primary and secondary LED chips 12, 14 aand 14 b can be disposed inside the opening 32 without being biased toone side, which helps light emitted from the LED chips 12, 14 a and 14 bto be more uniformly emitted to the outside, for example, through asemi-spherical encapsulation member, if mounted on the opening 32.Furthermore, the distances between the LED chips 12, 14 a and 14 b maybe decreased by setting a radius from the center C to the circumferenceR to be as small as possible.

The primary slug 22 has a cavity 222 formed on an upper surface thereofto accommodate the primary LED chip 12. The primary LED chip 12 isattached to the bottom of the cavity 222 which is filled with thephosphor 52 to cover the primary LED chip 12. In this embodiment, thephosphor 52 is mixed with a transparent resin, such as silicone, epoxy,etc., and fills the cavity 222. When the transparent resin is cured to asolid state, the phosphor 52 mixed with the transparent resin is securedinside the cavity 222 and serves to convert light emitted from theprimary LED chip 12 into white light. At this time, instead of fillingthe cavity 222 with the phosphor 52 and resin, the phosphor may becoated around the primary LED chip 12 by, for example, electrophoresis.

The two secondary LED chips 14 a and 14 b are attached to upper surfacesof the secondary slugs 14 a and 14 b. The secondary LED chips 14 a and14 b may be light emitting diodes that emit blue light, red light, greenlight, UV light, IR light, other colors, or light of differentwavelengths. Herein, the secondary LED chips 14 a and 14 b are used torealize colors other than white light. In this embodiment, two secondaryLED chips 14 a and 14 b, and two secondary slugs 24 a, 24 b having thesecondary LED chips 14 a and 14 b are used. However, the presentinvention is not limited thereto. For reference, if the LED package hasall of the secondary LED chips for emitting blue, red, and green colorswith the primary LED chip and phosphor provided to the LED package forrealizing the white light, the LED package can be used as an LED packagethat can selectively employ one of white, blue, red and green colors.

As shown in Circle “A” of FIG. 1, the bottom surface of the cavity 222of the primary slug 22 is coplanar with the upper surface of thesecondary slug 24 a at the same height H. This means that, even if theprimary LED 12 is mounted on the bottom surface of the cavity 222depressed below an upper surface of the primary slug 22, the mountingheight of the primary LED chip 12 is substantially the same as those ofother LED chips. This configuration can prevent differences inluminescence characteristics of the LED chips due to a height differencebetween the LED chips.

Referring again to FIGS. 1 and 2, particularly, to FIG. 2, all of theprimary and secondary LED chips 12, 14 a and 14 b are vertical type LEDchips, which can be electrically connected to the primary and secondaryslugs 22, 24 a and 24 b on the bottom surfaces thereof, respectively.Accordingly, each of the primary and secondary LED chips 12, 14 a and 14b is electrically wired by a single bonding method in which each LEDchip is electrically connected to a corresponding lead frame via asingle bonding wire W.

In this embodiment, the LED package 1 employs the vertical type LEDchips, each of which is electrically connected to the slug 22, 24 a or24 b and to the lead frame 40, as described above. However, the presentinvention is not limited thereto. According to the exemplary embodimentsof the present invention, the LED package permits installation oflateral type LED chips, each of which is electrically insulated from theslug 22, 24 a or 24 b and has two upper electrodes electricallyconnected to two lead frames 40 via two bonding wires.

Another embodiment of the present invention will be described withreference to FIG. 3 showing a different configuration from the aboveembodiment shown in FIG. 2. In the embodiment shown in FIG. 3, primaryand secondary LED chips 12, 14 a and 14 b are all lateral type LED chipsand each is electrically wired to two lead frames 40 via two bondingwires W by a double-bonding method. At this time, all of the LED chips12, 14 a and 14 b are electrically insulated from the slugs 22, 24 a and24 b. In this case, the slugs 22, 24 a and 24 b serve only as heatdissipation elements.

As such, to permit both vertical type LED chips and lateral type LEDchips to be used as the LED chips mounted on the plural slugs 22, 24 aand 24 b, the number of lead frames 40 is twice or more the total numberof slugs 22, 24 a and 24 b. If the number of lead frames 40 is twice thenumber of slugs 22, 24 a and 24 b, the respective lateral type LED chips12, 14 a and 14 b mounted on the slugs 22, 24 a and 24 b are connectedto all of the frames 40 by the double bonding method. In thisembodiment, both the total number of LED chips 12, 14 a and 14 b and thetotal number of slugs 22, 24 a and 24 b are 3, and the total number oflead frames 40 is twice the total number of slugs, or 6.

Additionally, although not shown in the drawings, the LED package mayinclude a Zener diode to electrically protect at least one LED chipamong the plural LED chips including the primary LED chip 12 and thesecondary LED chips 14 a and 14 b. The Zener diode is a semiconductordevice that permits electric current to rapidly increase by applicationof a relatively high voltage to a p-n junction in the reverse directionand permits the voltage to be maintained. Configuration and installationposition of the Zener diode are disclosed in Korean Patent No. 0558082issued to the applicant of this application.

Meanwhile, the present invention is not limited to the aforementionednumber and shape of the slugs. FIGS. 4 (a) to (c) show slugs accordingto other embodiments of the present invention.

In an embodiment shown in FIG. 4 (a), a single primary LED chip 12 and aphosphor 52 are disposed on a single primary slug 22, and a singlesecondary LED chip 24 a is disposed on a single secondary slug 24 a.Here, the primary slug 22 and the secondary slug 24 a have semicircularshapes and face each other on linear portions of the semicircularshapes. In an embodiment shown in FIG. 4 (b), with four slugs 22, 24 a,24 b, and 24 c separated from one another, a single primary LED chip 12and a phosphor 52 are disposed on a single primary slug 22, andsecondary LED chips 14 a, 14 b and 14 c are disposed on three secondaryslugs 24 a, 24 b and 24 c, respectively. An embodiment shown in FIG. 4(c) includes three slugs 22, 24 a and 24 b arranged in the shape of atrisected circle. For reference, the slugs of the embodiment shown inFIGS. 1 to 3 include three divided slugs 22, 24 a and 24 b, wherein theprimary slug 22 has a semicircular shape and a greater area than eitherof the secondary slugs 24 a and 24 b.

FIG. 5 is a perspective view of a multi-LED package according to yetanother embodiment of the present invention and FIG. 6 is a plan view ofthe multi-LED package shown in FIG. 5.

Referring to FIGS. 5 and 6, the multi-LED package 1 of this embodimentincludes a primary LED chip 12, secondary LED chips 14 and 16 foremitting different colors from that of the primary LED chip 12, a heatsink 20 mounting the primary and secondary LED chips 12, 14 and 16 whileacting as a heat dissipation member, lead frames 40 electrically wiredto operate the primary and secondary LED chips 12, 14 and 16, a housing30 supporting the heat sink 20 and the lead frames 40, and partitions220 formed on the heat sink 20 to define a space for accommodating theprimary LED chip 12.

The primary LED chip 12 is an LED chip for realizing white light. Thesecondary LED chips 14 and 16 may be selected from a red LED chip, agreen LED chip, a blue LED chip, an IR LED chip, and a UV LED chip. Forthe primary LED chip 12, a phosphor is coated around the primary LEDchip for realizing white light. Thus, if the primary LED chip 12 ismounted together with the secondary LED chips 14 and 16 in a singlepackage, a separate space may be provided for coating the phosphor onthe primary LED chip 12.

Accordingly, the partitions 220 may provide the space for accommodatingthe primary LED chip 12 and protrude from an upper surface of the heatsink 20. The partitions 220 may be made of the same material as the heatsink 20. The partitions 220 may be integrally formed with the heat sink20. With this configuration, the multi-LED package 1 can moreeffectively dissipate heat that results from operation of the primaryLED chip 12. Further, the phosphor (not shown) is also provided insidethe partitions 220 to cover the primary LED chip 12 accommodated insidethe partitions 220.

The space defined by the partitions 220 is open at an upper side andsurrounds the primary LED chip 12. Specifically, since the primary LEDchip 12 generally has four lateral sides, the partitions 220 may includefour contiguous protrusions, each protrusion corresponding to one of thefour lateral sides of the primary LED chip 12. However, the presentinvention is not limited to this configuration. In other words, thepartitions 220 may have any arrangement so long as a space is defined toaccommodate the primary LED chip and the phosphor therein.

In operation of the primary LED chip 12, a portion of light having apredetermined wavelength emitted from the primary LED chip 12 istransformed into light of a different wavelength by the phosphor, and isthen mixed with non-transformed light, realizing white light.

Further, the multi-LED package 1 includes a housing 30 that supports thelead frames 40 and the heat sink 20. The housing 30 is formed at anupper portion thereof with an opening 32 that surrounds the LED chips12, 14 and 16, that is, an internal space of a cavity. As described inthe above embodiment, the opening 32 may be molded with a transparentencapsulation material, which protects the LED chips 12, 14 and 16 fromthe external environment.

With this configuration, plural LED chips including an LED chip forrealizing white light in a single package can be mounted in themulti-LED package 1 according to this embodiment, thereby solving theproblem of the conventional LED package designed to realize variouscolors.

In FIG. 6, the LED chips 12, 14 and 16 are equidistant from the center Cof the heat sink 20. That is, the LED chips 12, 14 and 16 are disposedon an imaginary circumference R spaced a predetermined radius from thecenter C of the heat sink 20. With this configuration, for example, if asemi-spherical encapsulation member (not shown) is mounted on theopening 32, light emitted from the LED chips 12, 14 and 16 can be moreuniformly emitted to the outside through the encapsulation member. As aresult, design and application of secondary optics can be easilyaccomplished.

In FIGS. 5 and 6, the respective LED chips 12, 14 and 16 are lateraltype LED chips, each of which is electrically connected to the leadframes 40 by two bonding wires W. Thus, the heat sink 20 of thisembodiment may be formed into an integral body, which is different fromthe above embodiments wherein the slugs 22, 24 a, 24 b, and 24 c actingas the heat sink are separated from one another corresponding to the LEDchips.

In the embodiment shown in FIGS. 5 and 6, two secondary LED chips 14 and16 are shown. However, the secondary LED chips 14 and 16 simultaneouslyoperated to emit red, green and blue colors can all be mounted on theheat sink 20 to emit various colors. In other words, the secondary LEDchips 14 and 16 may be selected from a red LED chip, a green LED chip, ablue LED chip, an IR LED chip, and a UV LED chip.

FIGS. 7 (a) to (c) are schematic plan views of various modifications ofthe multi-LED package 1 shown in FIG. 5. FIG. 7( a) is a schematic viewof a multi-LED package that includes the primary LED chip 12 used forrealizing white light, partitions 220 disposed to surround the primaryLED chip 12, a single secondary LED chip 14 selected from the red LEDchip, green LED chip, blue LED chip, IR LED chip and UV LED chip, and aheat sink 20 on which the primary LED chip 12, secondary LED chip 14,and partitions 220 are mounted.

FIG. 7( b) is a schematic view of a multi-LED package that includes aprimary LED chip 12 accommodated inside partitions 220 to realize whitelight, three secondary LED chips 14, 16 and 18 selected from the red LEDchip, green LED chip, blue LED chip, IR LED chip and UV LED chip, and aheat sink 20 on which the primary LED chip 12, secondary LED chips 14,16 and 18, and partitions 220 are mounted. For example, referencenumeral 14 may indicate the red LED chip, reference numeral 16 mayindicate the green LED chip, and reference numeral 18 may indicate theblue LED chip.

FIG. 7( c) is a schematic view of a multi-LED package that includes aprimary LED chip 12 accommodated inside partitions 220 to realize whitelight, two secondary LED chips 14 and 16 selected from the red LED chip,green LED chip, blue LED chip, IR LED chip and UV LED chip, and a heatsink 20 on which the primary LED chip 12, secondary LED chips 14 and 16,and partitions 220 are mounted.

The multi-LED packages shown in FIGS. 7 (a) to (c) may also have thephosphor inside the partitions 220 along with the LED chip 12 forrealizing white light. The multi-LED package may include more secondaryLED chips than the multi-LED packages shown in FIGS. 7 (a) to (c). Thesemodifications are within the spirit and scope of the present invention,but to avoid cumulative description, they will not be separatelydescribed.

In the embodiments shown in FIGS. 5 to 7, the LED chips 12, 14, 16, and18 are illustrated as lateral type LED chips that are electrically wiredto the lead frames 40 via two bonding wires W by the double bondingmethod when mounting a single primary LED chip 12 and other secondaryLED chips 14, 16, and 18 together in a single package. However, thepresent invention is not limited thereto. That is, the use of thepartitions 220 disposed on the heat sink 20 to accommodate the primaryLED chip 12 for realizing white light can be applied to other types ofLED chips as well as the lateral type LED chip.

FIG. 8 shows a multi-LED package according to yet another embodiment ofthe present invention. In FIG. 8, a heat sink 20 further includesadditional partitions 221 for individually surrounding secondary LEDchips 14, 16, and 18 in addition to the partitions 220 surrounding theprimary LED chip 12. The partitions 220 and 221 are connected to oneanother to provide a lattice arrangement. The partitions 220 and 221protrude from the upper surface of the heat sink 20.

FIG. 9 shows a modification of the multi-LED packages shown in FIGS. 1to 4. In FIG. 9, the primary slug 22 is formed with a cavity 222 foraccommodating the primary LED chip 12 and the phosphor 52, and secondaryslugs 24 a, 24 b, and 24 c are formed with other cavities 222 a, 222 b,and 222 c for accommodating the secondary LED chips 14 a, 14 b, and 14c, respectively. Alternatively, the primary and secondary slugs 22, 24a, 24 b, and 24 c may be formed with partitions 220 and 221 instead ofthe cavities.

The cavities or partitions for accommodating the secondary LED chips mayreduce or suppress interference of light from the LED chips whilesimultaneously operating the primary and/or secondary LED chips. Thecavities or partitions for accommodating the secondary LED chips mayalso provide a phosphor to the secondary LED chips for a particularapplication.

As apparent from the above description, according to one embodiment ofthe present invention, the multi-LED package includes a white LED chipand other color LED chips in a single package to realize white light andvarious colors. Furthermore, according to one embodiment, the multi-LEDpackage may include an IR LED chip and a UV LED chip in a single packagealong with the white LED chip, thereby providing a variety of functionsto users.

According to one embodiment of the present invention, the multi-LEDpackage permits individual operation of plural LED chips for realizingwhite light and various colors.

According to one embodiment of the present invention, the multi-LEDpackage permits effective dissipation of heat from the LED chips to theoutside, thereby preventing service life and performance of the LEDchips from deteriorating due to the heat.

According to one embodiment of the present invention, the multi-LEDpackage permits the use of vertical-type LED chips electricallyconnected to the slugs or lateral-type LED chips electrically insulatedfrom the slugs, and exhibits excellent availability.

Although the present invention has been described with reference to theembodiments and the accompanying drawings, the invention is not limitedto the embodiments and the drawings. It should be understood thatvarious modifications and changes can be made by those skilled in theart without departing from the spirit and scope of the present inventionas defined by the accompanying claims.

1. A multi-light emitting diode (LED) package, comprising: a heat sinkcomprising a primary slug and a secondary slug separated from eachother; a primary LED chip mounted on the primary slug; a secondary LEDchip mounted on the secondary slug; a lead frame structure electricallywired to the primary LED chip and the secondary LED chip to individuallyoperate the primary LED chip and the secondary LED chip; and a phosphordisposed on the primary slug to cover at least a part of the primary LEDchip.
 2. The multi-LED package according to claim 1, further comprising:a housing to support the lead frame structure and the heat sink, andhaving an opening arranged at an upper portion of the housing, throughwhich light generated from the primary LED chip and the secondary LEDchip is emitted.
 3. The multi-LED package according to claim 1, whereinlight obtained by a combination of the primary LED chip and the phosphoris white light.
 4. The multi-LED package according to claim 1, whereinthe primary slug comprises a cavity on an upper surface to accommodatethe primary LED chip, the phosphor being arranged in the cavity.
 5. Themulti-LED package according to claim 4, wherein the primary LED chip isattached to a bottom surface of the cavity, the bottom surface of thecavity being coplanar with an upper surface of the secondary slug. 6.The multi-LED package according to claim 1, wherein the primary slugcomprises partitions protruding from an upper surface of the primaryslug, the partitions to define a space to accommodate the primary LEDchip, and the phosphor being arranged in the partitions.
 7. Themulti-LED package according to claim 1, wherein the primary slugcomprises first partitions or a first cavity arranged thereon toaccommodate the primary LED chip and the phosphor inside the firstpartitions or the first cavity, and the secondary slug comprises secondpartitions or a second cavity arranged thereon to accommodate thesecondary LED chip inside the second partitions or the second cavity. 8.The multi-LED package according to claim 2, wherein the heat sinkcomprises a single primary slug and a plurality of the secondary slugs,the single primary slug and the plural secondary slugs being disposedoutside a center of the opening, and the primary LED chip and aplurality of secondary LED chips are disposed along a circumferencearound the center of the opening on the single primary slug and thesecondary slugs, respectively.
 9. The multi-LED package according toclaim 1, wherein the primary LED chip and the secondary LED chip areeach selected from one of a vertical-type LED chip electricallyconnected to the heat sink in a direct manner and a lateral type LEDchip electrically connected to the lead frame structure by two bondingwires while being electrically insulated from the heat sink.
 10. Themulti-LED package according to claim 1, wherein the lead frame structurecomprises a plurality of lead frames, and the number of lead frames istwo or more times the sum of primary slugs and secondary slugs.
 11. Amulti-LED package, comprising: a heat sink comprising an upper surfaceand first partitions protruding from the upper surface; a primary LEDchip mounted inside the first partitions; a secondary LED chip mountedoutside the first partitions; a lead frame structure electrically wiredto the primary LED chip and the secondary LED chip to individuallyoperate the primary LED chip and the secondary LED chip; and a phosphordisposed on the heat sink to cover at least a part of the primary LEDchip.
 12. The multi-LED package according to claim 11, furthercomprising: a housing to support the lead frame structure and the heatsink, and having an opening arranged at an upper portion of the housing,through which light generated from the primary LED chip and thesecondary LED chip is emitted.
 13. The multi-LED package according toclaim 11, wherein light obtained by a combination of the primary LEDchip and the phosphor is white light.
 14. The multi-LED packageaccording to claim 13, wherein the secondary LED chip is selected from ared LED chip, a green LED chip, a blue LED chip, an infrared LED chip,and an ultraviolet LED chip.
 15. The multi-LED package according toclaim 12, wherein the primary LED chip and the secondary LED chip aredisposed along a circumference around a center of the opening.
 16. Themulti-LED package according to claim 11, wherein the first partitionsare integrally formed with the heat sink.
 17. The multi-LED packageaccording to claim 11, wherein the heat sink further comprises secondpartitions protruding from the upper surface to surround the secondaryLED chip.